Electroplating intermediate of Cu - Wuhan Silworld Chemical Co.,Ltd

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Bis-(sodium sulfopropyl)-disulfide ,CAS:27206-35-5, C6H12O6S4Na2 CAS No:27206-35-5
Sodium 3-mercaptopropanesulphonate,CAS:17636-10-1 ,C3H7O3S2Na CAS No:17636-10-1
N,N-Dimethyl-dithiocarbamyl propyl sulfonic acid, CAS:18880-36-9, C6H12NaO3S3, wetting agents CAS No:18880-36-9
Sodium 3-(benzothiazol-2-ylthio)-1-propanesulfonate ,49625-94-7,C10H10NnaO3S3 CAS No:49625-94-7
3-S-Isothiuronium propyl sulfonate, CAS:21668-81-5,C4H10N2O3S2,non-ionic surfactants. CAS No:21668-81-5
Polyethylenimine, CAS:25987-06-8 ,H(NHCH2CH2)nNH2,9002-98-6 CAS No:25987-06-8
1H-Benzotriazole ,95-14-7,C6H5N3 CAS No:95-14-7
2-Mercaptothiazoline,96-53-7,C3H5NS2 CAS No:96-53-7
N,N,N',N'-Tetrakis(2-hydroxypropyl)ethylenediamine , 102-60-3, C14H32N2O4 CAS No:102-60-3
2-Mercapto benzanidazole,583-39-1,C7H6N2S CAS No:583-39-1
Ethlenethiourea,96-45-7,C3H6N2S CAS No:96-45-7

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